ISO uses the term, Integrated Circuit Card (ICC) to encompass all those devices where an integrated circuit is contained within an ISO ID1 identification card. Identification cards — Integrated circuit(s) cards with contacts — Part 1: Physical characteristics. ISO/IEC specifies the physical characteristics of integrated circuit cards with contacts. It applies to identification cards of the ID-1 card type, which.
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This is 77816-1 accomplished by some form of access code which may be quite large 64 bits or more. The thickness of the card is particularly important for Smart Card readers because of the mechanical construction of the card connector mechanism.
The guard time is defined to be equal to two bit periods although for block mode it can be changed to a 1 bit period. The RSC interface however defines two separate wires for data transmission and reception which would need hardware modification in order to interface with the single wire IC card directly. Return to page 1.
The resistance of the card to static electricity is defined by a test set up as shown in figure 8. The temperature at the bonding interface can reach C. Registration of application providers”. The latter frequency has kso simple divisor of in order to achieve a bit per second communication speed. Commands for card management”. Identification of persons using biometric methods is outside the scope of this standard.
The activation sequence for the interface 7861-1 is defined as follows. The first part of the process is to manufacture a substrate which contains the chip. Created inamended in,updated in Let us know what you have to say: It is clear however that we should attempt to minimise the contents of the chip on both cost and reliability grounds commensurate with the particular application.
Retrieved from ” https: This is the signal line by which the chip receives commands and interchanges data with the outside world. This page was last edited on 19 Aprilat A mylar sheet is stuck to the back of the wafer so that following separation the dice remains attached to the mylar film.
The ISO connector is so designed to constrain the silicon die size to about 25mm2 although it is possible to handle 35mm2 or more.
The 7816-11 standard is designed to address electrical signals and reset signals for synchronous 7816. In effect it acts as a polarisation key and may be used to aid the correct insertion orientation of the card.
The principal parameters of ISO are the dimensions of the ID -1 card which are defined to be, iiso This standard relates isp the card identification number or PAN Primary Account Number which consists of three parts, the issuer identifer number IINthe individual account identifier and the check digit. These specifications are defined by ISO as part three of the standard. This is an additional characteristic to the magnetic field sensor which operates off the magnetic stripe and is used to open a mechanical gate on devices such as ATMs where some vandal proofing techniques are uso.
The ISO standard defines the location of contacts and dimensions. ISO is a family of standards primarily dealing with aspects of smart card interoperability regarding communication characteristics, physical properties, and application identifiers of the implanted chip and data. The ICC is probably the security man’s lso because unlike most electronic storage and processing devices it has security intrinsically built in. The chip itself varies considerably between different manufacturers and for a whole gambit of applications.
Application code can be loaded into the PROM memory in minutes with no further reference to the chip manufacturer. There is a further problem with the asynchronous character transmission that makes life difficult for a PC to act as the interface device. The manufacturer of a chip with the user’s ROM code takes on average three months. So what does the chip contain.
This is accomplished by using the basic commands contained in the operating system in the mask ROM. Newer chip fabrication technologies are moving sub micron, 0. Given the close coupling normally achieved between an IC card and the interface device one has to question whether this level of error control has sufficient benefits to outweigh the disadvantages.
ISO/IEC – Wikipedia
The choice of chip location has been a difficult subject due largely to the use of magnetic stripes. As 78166-1 move higher in the architecture towards the specification of the application then the problems of interoperability are less relevant since it is not generally necessary to have compatibility between the applications themselves.
This device often consists of a movable carriage that positions the card under the connector head while applying the necessary wiping and pressure action. ISO Identification cards – Physical characteristics This was preferable because of the residual risk of chip damage due to bending. Introduction To Smart Cards – Page 2. Area 2 is provided for the cardholder identification data such as his name and address.
The transmission protocol must take account of this need to turn the line around. For example the ISO allows a card current supply of up to mA. Many observers have commented that the widespread use of Smart Cards is being impeded by the lack of standards. In each case the semiconductor wafer manufactured by the semiconductor supplier is diced into individual chips. ISO Identification cards numbering system 78116-1 registration procedure for issuer identifers There are a number of factors to be decided in the specification of the integrated circuit for the Smart Card.
The following list represents the more commonly used memory types: The choice of card material effects the environmental properties of the finished product. Two transmission protocols are included in it: Introduction To Smart Cards. This part of the card development process is clearly specific to the particular application.